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The most frequently used and, from an economical standpoint, most important PVD process is sputtering. Due to its high flexibility, it is used in numerous industries. Sputtering can be used to apply many different materials to a wide variety of surfaces. It is used, for example, in the semiconductor industry, in the finishing of materials, in the optical industry and even in the coating of large glass surfaces on buildings. FHR Anlagenbau GmbH is a global technology leader in this segment. FHR manufactures first-class coating systems and sputtering targets of the highest quality. Our expertise in this discipline is the result of many years of experience and a passion for innovation.

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In the PVD process, the material – known as the target – is kept in solid form in the system for subsequent thin film coating. This material is then vaporized, and grows as a thin film on the substrate surface. There are various methods that can be deployed when vaporizing the material, e.g. with a laser, an electric arc or by bombarding it with particles.

There are also PVD techniques in which the material is transferred into a gas state by heating (thermal vapor deposition). Molecular beam epitaxy and ion beam-guided deposition also belong to the group of PVD processes. The resulting coatings are particularly pure, uniform and achieve a very high level of adhesion to the substrate. PVD coatings, therefore, offer an environmentally friendly alternative to conventional electrochemical processes for numerous areas of application.

Physical vapor deposition, or PVD for short, refers to techniques used to apply thin coatings to substrates. All of these processes are carried out in a vacuum.

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Discover the diverse range of possibilities with our vacuum coating technology, and place your trust in FHR as your reliable partner for outstanding coating solutions. Please feel free to get in touch with us to find out more and realize your projects together.

Physical vapor deposition, often referred to by the abbreviation “PVD”, is a process where the material is vaporized as a target in the process chamber, and applied as a thin film to the surface to be coated (substrate). Subsequently, many different materials can be deposited on a wide variety of substrates.

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