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Physical vapour depositionmethod PDF
CNMG432 EDP:100848
Physical vapour deposition coatingpros and cons
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Physicalvapordeposition
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PVDcoatingfull form
Thermal evaporation uses the heating of a material to form a vapour which condenses on a substrate to form the coating. Heating is achieved by various methods including hot filament, electrical resistance, electron or laser beam and electric arc.
There are many uses for coatings prepared by PVD; applications include aluminium tracks and ceramic resistors for electronic circuitry; anti-reflective ceramic coatings for optics; decorative coatings on plastics; corrosion resistant coatings on gas turbine blades; and wear prevention coatings for machine and press tools.
All three techniques can be used for the direct deposition of a material or for 'reactive' use in which chemical reaction occurs in the vapour/plasma phase between atoms of the coating material and 'reactive' gases.
There are three main types of PVD, all of which are undertaken in a chamber containing a controlled atmosphere at reduced pressure (0.1 to 1 N/m 2):
Physical vapour depositionppt
The temperature of the substrate being coated is typically in the range of 200-400°C, considerably lower than temperatures associated with CVD (chemical vapour deposition, the other thin-film process). PVD is a line-of-sight process and requires the substrate surface to be easily accessible. Some components are rotated to produce even coatings.
PVD is a batch coating process with typical cycle times of 1 to 3 hours, depending on the material being deposited and the desired coating thickness. Common coating rates are 50 to 500µm/hr depending on the technique. Coated components do not require additional machining or heat treatment.
Physical vapour deposition (PVD) is a thin-film coating process which produces coatings of pure metals, metallic alloys and ceramics with a thickness usually in the range 1 to 10µm. Physical vapour deposition, as its name implies, involves physically depositing atoms, ions or molecules of a coating species on to a substrate.
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