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The document provides an overview of chemical vapor deposition (CVD) and physical vapor deposition (PVD) processes. CVD involves reacting vapor phase chemicals in a chamber to form a thin solid film on a substrate. It can be used to deposit a variety of materials. PVD involves physically vaporizing a material in a chamber and re-depositing it as a thin film on a substrate. It has various variants like sputtering and evaporative deposition. Both CVD and PVD are used to deposit thin films for applications like semiconductor devices, coatings, optical fibers and composites.Read less