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In CVD, a substrate is heated, on the surface of which a solid component is deposited from the gas phase as a result of a chemical reaction. In order to be able to deposit the solid layer at a specific reaction temperature, volatile compounds of the layer components must be present.

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That is why venting a high-vacuum chamber is always a major challenge. It is important to aerate them slowly and in a controlled manner, because venting too quickly creates turbulence that stirs up particles in the chamber.

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Physical vapor deposition only works in high vacuum because an extremely clean environment is essential for the manufacture of microchips, CDs and DVDs. Even the smallest particles are a big problem.

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CVD (Chemical Vapor Deposition) and PVD (Physical Vapor Deposition) are coating processes that are often used for the surface treatment of tools and molds.

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At SMC you get all the components you need for CVD processes and for ventilation and evacuation of your high-vacuum chamber for PVD processes: a wide variety of valves, temperature control units, sensors, etc.

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PVD is based on physical vapor deposition. These are vacuum-based coating processes or thin-film technologies. In contrast to the CVD process, the layer is formed here directly by condensing a material vapor from the starting material.

Physical vapor deposition involves very low pressure (high vacuum) and comparatively low temperatures, typically resulting in very thin coatings.

In contrast to physical processes, chemical vapor deposition can also be used to coat surfaces with complex three-dimensional shapes, such as the finest indentations in wafers.

Chemical Vapor Deposition (CVD) is a coating process that produces thicker layers and is subject to comparatively high pressure and temperature. The most important application of CVD is wafer coating.