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With CR-8000 Design Force from Zuken, the back drilling of vias is no longer an afterthought during board production. It becomes an integral part of board design. And here is how it works:

Using the example of the analysis of SerDes transmission paths such as PCI Express, SATA or USB3, we explain the methodology of an analysis- and constraint-driven assembly development with CR-8000 Design Force.

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Checking for potential electromechanical collisions is usually done more in the mechanical design environment. However, shifting the check to the electrical side during component placement can help create a more robust product. For multi-board PCB design, there are several built-in checks in Design Force that validate the design for collision and clearance requirements.

Backdrilling PCB

Wireless Power Transfer (WPT) is replacing cables and wires in consumer electronics, electric vehicles (EVs), and healthcare. Zuken offers a suite of solutions that help engineers design, simulate, and validate WPT systems. Learn more.

A trend towards low power design prevails in the electronics industry today and is not likely to change in the near future. This development is driven by many reasons but primarily by the performance and storage density demands of mobile devices, where a reduction of the power consumption is crucial to extending battery life without sacrificing the bandwidth. This comprehensive guide helps you mitigate LPDDR4 Design.

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PCB controlled depth drilling

A trend towards low power design prevails in the electronics industry today and is not likely to change in the near future. This development is driven by many reasons but primarily by the performance and storage density demands of mobile devices, where a reduction of the power consumption is crucial to extending battery life without sacrificing the bandwidth. This comprehensive guide helps you mitigate LPDDR4 Design.

With its support of 3D, CR-8000 Design Force offers the possibility of validating PCB designs against the mechanical envelope. In this session you will learn how to use formats such as IDX and JT in Design Force or, alternatively, how to import native 3D data from various MCAD systems.

Backdrill vs blind via

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Machining centre realized to satisfy all the operations of drilling, routing, cutting and hardware insertion, the only one in which the high effici...

The downside of this approach, however, is represented by undesirable antenna and cross talk effects that will be caused by the unconnected parts of the vias at elevated clock speeds. To eliminate these parasitic effects, the unused via stubs need to be drilled out to a defined depth during the final phase of board production. This process is referred to as back drilling.

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Back drillpcb design

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Back drilling vias is a cost-effective alternative to buried vias in multi-layer board manufacturing. While blind and buried vias require separate drilling and plating operations for the related inner layers, it is certainly a cheaper alternative to simply drill and plate through all layers of a multilayer board.

Backdrilling process

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Wireless Power Transfer (WPT) is replacing cables and wires in consumer electronics, electric vehicles (EVs), and healthcare. Zuken offers a suite of solutions that help engineers design, simulate, and validate WPT systems. Learn more.

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